How2Power.com
Answering your Questions about Power Design  

Heat-sink-attachment methods optimize thermal performance

Focus:

System configuration, board assembly, and thermal needs influence choice of heatsink attachment option


What you’ll learn:

  • How to select a method of heatsink attachment
  • How to select a thermal interface material
  • How to account for influence of contact pressure on thermal resistannce of interface materials


View the Source


Author & Publication:

Christopher Soule Aavid Thermal Technologies Inc , EDN, Sep 21 1999

This article summary appears
in the HOW2POWER Design Guide.


The Design Guide offers
organized access to
hundreds of articles
on dozens of power conversion
and power management topics.


The Design Guide search results
include exclusive summaries
and accurate "how to" analysis
to help you make faster,
more informed decisions.

Search
for more articles


   
   
   
   
   
About | Design Guide | Newsletter | SiC & GaN | Power Magnetics | Power Links | Events | Careers | Bookstore | Consultants | Contacts | Home | Sitemap   

This site is protected by copyright laws under U.S. and international law. All rights reserved.