Liquid Cooling for High-Power Electronics

Focus:

A common approach to cooling high-power IGBT modules is to attach a modules to heat spreader which is then mounted to a cold plate using a thermal interface material. However, the thermal resistivities of the thermal interface material and the heat spreader represent a bottleneck to cooling and limit the power dissipation that can be allowed for the IGBT die. A novel micro-channel cold plate with low core resistivity and the ability to be directly bonded to a DBC substrate allows IGBT modules to achiever greater power dissipation by removing in excess of 1000W/cm2.

What you’ll learn:

• How to improve cooling of IGBT modules by improving cold-plate performance
• How to improve cold-plate cooling for next-generation (SiC and GaN) power semiconductors

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Author & Publication:

Javier Valenzuela, President, Thomas Jasinski, Director of Thermal Systems, and Zahed Sheikh, Vice President of Business Development, Mikros Technologies, Claremont, N.H., Power Electronics Technology, Feb 01 2005

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