Increasing Power Density In Three-Phase Inverters With Direct-Cooled SiC Power Modules

Focus:

Wolfspeed’s XM3 half-bridge power module with direct-cooled baseplate optimizes the performance of the company’s third-generation SiC MOSFETs. The direct-cooled baseplate integrates liquid cooling, which improves thermal performance and enables greater power delivery than the conventional flat baseplate version, which attaches to a liquid-cooled heatsink. In this article, the characteristics of both module types are described and the performance and manufacturing benefits of the direct-cooled modules versus the flat- baseplate module are explained and demonstrated. The improved performance of the direct- cooled module is verified experimentally and the different methods of measuring the junction temperature are noted. The system-level advantages of the direct-cooled module are then demonstrated in a three-phase inverter design example, which uses an 800-V bus like that used in electric vehicle applications.

What you’ll learn:

• How to improve the cooling performance and power density of half-bridge SiC power modules using a baseplate with integrated liquid cooling
• How to increase the power output capability of SiC half-bridge modules in EV applications

View the Source

Author & Publication:

Matthew Feurtado, Matt Reeves, Daniel Martin, and Ty McNutt, Wolfspeed, Fayetteville, Ark. and Wieland Microcool, Bend, Ore., How2Power Today, Oct 15 2020

This article summary appears
in the HOW2POWER Design Guide.

The Design Guide offers
organized access to
hundreds of articles
on dozens of power conversion
and power management topics.

The Design Guide search results
include exclusive summaries
and accurate "how to" analysis
to help you make faster,
more informed decisions.

Search
for more articles