MOSFET Packaging Innovations For SWaP-Optimized Space Power Systems

Focus:

In space-rated power electronics, reliable attachment of surface-mount hermetically- packaged power MOSFETs to printed circuit boards (PCBs) has been challenging. Material differences between the PCB and surface mount device (SMD) package result in a mismatch between their coefficients of thermal expansion (CTEs), making it difficult to maintain reliable solder joints between the SMD and the PCB. This article discusses how IR HiRel’s rad hard FET package design, the SupIR-SMD, solves the CTE mismatch challenge while enabling significant size, weight and power (SWaP) and cost advantages. After reviewing the CTE characteristics of commonly used package and board materials, and examples of damage caused by CTE mismatch, the authors look at previous solutions to this problem--the lead-attach and carrier solutions, noting their benefits and drawbacks. They then explain how construction of the SupIR-SMD overcomes the CTE mismatch while reducing the size and cost penalties associated with the existing solutions.

What you’ll learn:

• How to save space and reduce costs in space power systems by using rad hard power MOSFETs packaged in the SupIR-SMD
• How to understand the causes of CTE mismatch for surface-mount hermetically packaged MOSFETs in space applications

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Author & Publication:

Oscar Mansilla, Rushi Patel and Michelle Lozada, International Rectifier HiRel (IR HiRel), an Infineon Technologies Company, San Jose, Calif., How2Power Today, Nov 15 2021

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