ISSUE: July 2020


To ensure receipt of future issues, please add to your address book. Visit



» Analysis, Simulation And Experimentation Enable Successful Design Of Power Supply Compensation

» Different Approaches To Learning And Applying Digital Signal Processing In Power Electronics

» Focus On Magnetics:
Interstitial Wire Interleaving Packs More Conductor Into Magnetic Windings

» Spotlight On Safety & Compliance:
Mounting Bridge Rectifiers: Compliance Needs Make It Complicated

» New Power Products

» Other Top Power News

From the Editor's Desk

David G. Morrison
Editor, HOW2POWER TODAY       

Electronics technology is continually evolving and advancing with new components, instruments and design tools to aid engineers in meeting new design goals. Several of the innovative components in this month’s Power Products section attest to this ongoing progress. Even in midst of the pandemic, component development and product launches proceed unabated. Some examples reported in this issue include a fully integrated voltage regulator IC, SiGe rectifiers, and a better rad hard MOSFET package. However, efforts to better understand and explain basic engineering concepts and design tasks, also evolve as evidenced by our two design features. Christophe Basso’s article on designing power supply compensation, reviews this familiar topic with a tutorial that explains in detail multiple ways to analyze and simulate the response of a power stage, tips on applying the three types of compensation, and advice on verifying the compensator design with a prototype and further analysis. While many of these techniques have been discussed before, new treatments of the subject like Basso’s help to illuminate aspects that may have been neglected in previous works, and reflect the author’s vision of how to tie the information together. Certainly, Dennis Feucht’s feature on digital signal processing does some of the latter, as he compares the different ways that the DSP subject has been explained in different math and engineering disciplines, helping engineers to grasp the connections between the various methods and how they are best applied (conceptually) in power electronics. He also reviews the classics of DSP literature, giving engineers guidance on which references have stood the test of time in explaining the subject. Enjoy these and other articles in the July issue.


Analysis, Simulation And Experimentation Enable Successful Design Of Power Supply Compensation

by Christophe Basso, ON Semiconductor, Toulouse, France

Loop control represents an important aspect of the design of a switching power supply. However, for various reasons, its study is often relegated to the end of the project when the main components have already been selected. Through simple trial and error, it is sometimes possible to get the impression that a design delivering an acceptable transient response on the oscilloscope is ready for production but this is a very unwise and potentially costly attitude. Without a thorough analysis backed up by simulations and loop measurements, you have no idea what phase and gain margins look like and how solid they are. It is very likely that such a loosely designed converter will fail in production or shortly after being powered in the field. To keep you away from such situations, this article reviews some of the tools currently available to let you calculate, simulate and measure your prototype’s control loop before safely pressing the production start button. Read the article…

Once you have the transfer function
magnitude/phase plot in hand for your
power stage, you can think of a
compensation strategy consisting of
placing poles, zeroes and gain (or
attenuation) at various frequency
locations to meet your design goals

A “mixed-waveform” analog and
digital system with a sampled
feedback loop such as might be
found in a digitally controlled power
supply. ADC and DAC are sample-
hold components that convert
between ratios of digital counts and
voltage ratios.

Different Approaches To Learning And Applying Digital Signal Processing In Power Electronics

by Dennis Feucht, Innovatia Laboratories, Cayo, Belize

One of the early confusion factors in learning digital signal processing (DSP) is the rather different emphases placed upon it in DSP books. If you learn DSP from a book like the Prentice-Hall classic, Digital Signal Processing, by Oppenheim and Schafer (or from Alan Oppenheim’s excellent MIT video course), or even more so, from another Prentice-Hall book, Digital Filters, by R.W. Hamming, you will get a filter-oriented view of DSP. On the other hand, if you learn it by reading digital control books, you will acquire a control-oriented view. And more basically, if you learn it by reading numerical analysis books of mathematics, you might wonder how it is related to electronics (or engineering). What then is the best approach to an efficient acquisition of the subject? In this article, the author explores this issue from a power electronics perspective. Read the article…

Sponsored by Payton Planar Magnetics
A monthly column presenting information on power magnetics design, products, or related technology

Interstitial Wire Interleaving Packs More Conductor Into Magnetic Windings

by Dennis Feucht, Innovatia Laboratories, Cayo, Belize

One of the limitations on winding efficiency is the packing factor, kp, the fraction of winding area that is conductor. Ideally the conductive part of a winding—the copper or aluminum part of the wire turns—would completely fill the area allotted to a particular winding, and the current and power density would then be maximum. However, gaps between round wires result in areas not conducting current. This article proposes a way to reduce gaps and thus increase the winding fill factor, kf by filling these gaps with smaller wires. After reviewing the various packing factor components that quantify winding density, we’ll analyze how to determine the optimum wire size for the smaller wire in square-layered and hexagonal-layered winding configurations. We’ll also determine the improvement in fill factor obtained in each case. Read the full article…

One possible way to alleviate the
packing factor problem is to fill in
the gaps between adjacent wires
in a layered winding with
smaller-sized wire

Sponsored by Power Integrations
A monthly column discussing standards and regulatory requirements affecting power electronics

Mounting Bridge Rectifiers: Compliance Needs Make It Complicated

by Kevin Parmenter, Chair, and James Spangler, Co-chair, PSMA Safety and Compliance Committee

Among the various types of semiconductor devices, bridge rectifiers are somewhat unusual in that they are subject to safety agency certifications such as UL. These devices have agency approvals because they often connect to the ac mains in their applications. In addition, higher-power bridge rectifiers are usually mounted on a chassis or heatsink, such that they become part of the isolation safety barrier and therefore subject to creepage and clearance considerations as well as hi-pot testing. There are also maximum touch temperatures that affect rectifier usage. The requirements for isolation and heat removal are often in conflict. This article discusses techniques and strategies for satisfying these requirements—real world best practices—and highlights some of the pitfalls to avoid when mounting bridge rectifiers in your applications. Read the full article…

Vicor Header

Power that meets your most critical requirements

Modular power components enable engineers to design a complete power system that solves difficult space and efficiency challenges and virtually eliminates the possibility of last-minute surprises and delays. A power delivery network of DCM DC-DC converters, used independently or with downstream point-of-load ZVS buck and buck boost regulators, provide superior power system performance and connectivity from a variety of unregulated power sources to the point of load.

Read this article

More from Vicor:

Powering robots that harvest, move and deliver

Power delivery insights: educational videos and webinars

Automotive Electrification: What are the benefits of decentralized power architecture?



Empower Semiconductor’s EP70xx
Integrated Voltage Regulators.

Voltage Regulator ICs Take Monolithic Integration to Another Level

 Photo: The IVR is a high-performance switching regulator that is said to eliminate or integrate all discrete components in a single device. The company is touting the IVR as the “world’s fastest and smallest voltage regulator”.

 Drawing: A PMIC solution implementing multiple point-of-load converters (POLs) with up to 11 A of total output requires 40+ discrete components and 280 mm2 of pc-board space. An IVR with multiple POLs capable of up to 10 A of total output requires only one device and occupies only 17 to 25 mm2 of board area.

See the full story…

IR HiRel’s SupIR-SMD package.

A Better Package For Rad Hard MOSFETs—PCBs Meet Their (CTE) Match

 Photo: Optimized for surface-mount attach and capable of direct-to-PCB mounting, the SupIR-SMD relieves thermally-induced stress in the solder joint between the PCB and device package, while also minimizing thermal and electrical resistance.

 Drawing: Traditionally, designers have resorted to a “dead bug” and lead configuration, where the packages are flipped upside down and soldered to the PCB via leads. Dead bug soldering dissipates heat sub-optimally and decreases MOSFET power capacity. This practice can be avoided by using the SupIR-SMD.

See the full story…

Nexperia’s PMEGxGxELR/P SiGe

Silicon Germanium Rectifiers Enable Higher Efficiency In High Temperature Applications

 Graph: SiGe rectifiers enable new tradeoffs in forward voltage vs. leakage current for rectifiers used in power designs at 100 to 200 V. The rectifiers feature reduced reverse current compared to Schottky diodes, yet also exhibit lower forward voltage versus fast recovery rectifiers, leading to low power losses.

 Graph: The high thermal stability of SiGe rectifiers also distinguishes these devices from Schottkys. The SiGe rectifiers are stable at up to and beyond 175°C, which is the specified limit of the CFP package.

See the full story…

Dialog Semiconductor’s SLG47105

Configurable Mixed-Signal IC Adds High-Voltage Capability For Driving Motors

 Diagram: A member of the GreenPAK product family, the HV PAK combines configurable, mixed-signal logic and high-voltage H-bridge functionality in a 2- x 3-mm QFN. A single device can drive two brushed dc motors, a single stepper motor, a solenoid, or any other load requiring up to 1.5 Arms per output, and an operating voltage up to 13.2 V.

See the full story…

Renesas Electronics’ HIP2211 and
HIP2210 half-bridge MOSFET drivers.

100-V Half-Bridge MOSFET Drivers Offer Ruggedness And High Performance

 Diagram: The HIP2211 is a next-generation pin-compatible upgrade to Renesas’ popular ISL2111 bridge driver, while the HIP2210 offers a tri-level PWM input to simplify power supply and motor drive design. When compared with the ISL2211, the HIP2211 provides lower typical propagation delay, lower typical delay matching and a wider operating voltage range.

See the full story…

More Power Products. . .

MLCC Squeezes 0.1 µF Into 008004 Package

Switcher IC Powers EV Subsystems Directly From 400-Vdc Bus

SiC-Based Three-Phase Driver Module Delivers 80 A Peak, Is Fully Integrated

6U VITA-62-Compliant Power Supply For MIL-COTS VPX Applications

Scope Software Options Aid Power Management Debug

Dual-Channel Buck Converters Feature Low EMI And Stackable Outputs

2-kW Industrial Power Supply With PFC Is Rugged, Compact And Light


Efficient Power Conversion (EPC) and VPT have announced the establishment of EPC Space, a joint venture focused on designing and manufacturing radiation hardened GaN-on-silicon transistors and ICs, which are packaged, tested, and qualified for satellite and high-reliability applications.

The IEEE Nuclear & Space Radiation Effects Conference (NSREC), which had been postponed from July to December 2020, is transitioning to a virtual event..

Vicor, a provider of high-density and high-efficiency power management solutions, has joined the Global Semiconductor Alliance.

ROHM and LEADRIVE have established a joint laboratory to co-develop SiC-based automotive inverters.

LoadSlammer, Steve Sandler and Picotest have formed a joint venture to develop a family of the world’s fastest GaN-Based slew rate testers.

Cree is donating $3.5M to support a STEM education program for the SUNY Polytechnic Institute as part of a long-term commitment to help expand the local economy in New York’s Mohawk Valley and develop a pipeline of high-tech professionals.

According to a report from MarketsandMarkets, the global power electronics market size is expected to grow from $35.1 billion U.S. in 2020 to $44.2 billion by 2025, at a CAGR of 4.7%.

The Applied Power Electronics Conference is reaching out to industry experts to review digests of technical paper submissions for the APEC 2021 conference, while also issuing its call for papers.